Jason Ball's TechBytes

Technology & Venture Capital. Early stage venture capital news mixed with personal views and comments

Under the Hood- Apple iPhone 3G Chipsets

If chipsets are your thing, then feast your eyes on the latest iPhone teardown:

It’s interesting that Apple have chosen to go with so many components – making the iPhone larger than it could have been if they had used integrated, monolithic die. It’s interesting to see Infineon seem to be taking over the board though…
“…Infineon won big. It supplies the UMTS transceiver, suspected to be the PMB 6952, as well as the baseband processor, which is actually a two-chip module in a single package. The first chip is the X-Gold 208 (PMB 8877), which caters to GSM/GPRS/EDGE waveforms. The second chip is marked the PMB 8802 and is suspected to be the WCDMA/HSDPA accelerator for 3G. While there’s still some debate as to whether this combo package with Apple markings may in fact be Infineon’s XGold 608 (PMB 8878)

Filed under: iPhone

All things mobile @ Mobile 2.0 Europe


Who knew, my old alma mater, ESADE, has gotten hip and is hosting this year’s Mobile 2.0 Europe conference. If you haven’t looked at who’s attending, here’s a comprehensive list.
And hey, be sure to catch the often quoted, Dr Maximilian Niederhofer at 11:45….

Filed under: Events, Conferences and Panels

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